UGC-DAE Consortium for Scientific Research
( An Autonomous Institution of University Grants Commission, New Delhi )
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Deposition facilities in UHV-Thin Film Laboratory
Mr. S. R. Potdar/Dr. Mukul Gupta
UGC-DAE-CSR, Indore
Photo of RF-Ion Beam Sputtering System
e-beam evaporation deposition system
UHV (<5x10-10 Torr) e-beam evaporation system is equipped with 3 kW and 6 kW e-guns with 3 pockets on each gun. It has cold shrouds to minimise thermal degassing and cross contamination shutter assembly for thickness control. Substrate rotation, cooling and heating (80-900K) are also possible. The thickness of deposited films is measured in-situ using a quartz crystal thickness monitor. It is also possible to analyse presence of impurities using a RGA (Residual gas analyser). The system is equipped with a turbo-molecular pump, ion pump and TSP to achieve UHV conditions. The system can be baked at about 400K. The source to target distance can be varied from 30 cm - 80 cm and uniform deposition over 10 cm diameter is possible.

Ion Beam Sputter (IBS) deposition system

This ion source produces an ion beam of desired gas (Argon, Nitrogen, Oxygen etc.) with a diameter 30 mm at source with energy 0.2-1.2 keV and beam current 20-100 mA which can be used to sputter a target subsequently to deposit a thin film. The ion source uses RF to ignite plasma and a RF electron source to neutralize the ion beam, enabling to sputter both conducting as well as insulator materials. The stability of ion beam current, voltage is very good making it possible to prepare multilayers with a very low variation in the individual layer thickness. This source was tested and optimized for deposition of various types of thin films.


Photo of e-beam deposition system
Relevant publications

Mechanism of stress relaxation in nanocrystalline Fe-N thin films, Ranjeeta Gupta, Ajay Gupta, W. Leitenberger, and R. Rüffer, Phys. Rev. B 85, 075401 (2012).

Study of ultrathin magnetic cobalt films on MgO(001), G. Sharma, U. P. Deshpande, D. Kumar, and A. Gupta, J. Appl. Phys. 112, 023910 (2012)

Surfactant controlled interdiffusion in thermally evaporated Cu/Co multilayers, S. M. Amir, Mukul Gupta and A. Gupta, Journal of Alloys and Compounds (2012).

Surfactant mediated growth of Ti/Ni multilayers, M. Gupta, S. M. Amir, A. Gupta and J. Stahn, Applied Physics Letters 98, 101912 (2011).

Development of an ion beam sputtering system for depositing thin films and multilayers of alloys & compounds, Mukul Gupta, A. Gupta, D.M. Phase, S.M. Chaudhari, and B. A. Dasannacharya, Applied Surface Science 205, 309-322 (2003).